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PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production
Détails sur le produit:
| Lieu d'origine: | Chine |
| Nom de marque: | MK |
| Numéro de modèle: | MKSP-S630T |
Conditions de paiement et expédition:
| Quantité de commande min: | 50 pièces |
|---|---|
| Prix: | negotiable |
| Détails d'emballage: | Emballage en contreplaqué solide avec un matériau de protection souple approprié à l'intérieur, adap |
| Délai de livraison: | 10-20 jours ouvrables |
| Conditions de paiement: | LC, D/A, D/P, T/T, Western Union |
| Capacité d'approvisionnement: | 10000 mètres carrés par mois |
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Détail Infomation |
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| Matière première: | Acier inoxydable SUS630T domestique de haute qualité | Épaisseur standard: | 1.0-2.0 mm |
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| Largeur maximale: | ≤ 1300 mm | Longueur maximale: | ≤2410mm |
| Nom du produit: | Plaque de presse de stratification PCB et CCL SUS630T | Rugosité de la surface: | Ra≤0,15 μm, Rz≤1,5 μm |
| Mettre en évidence: | SUS630T high-hardness lamination press plate,high-temperature resistant steel plate for PCB,corrosion resistant CCL production steel plate |
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Description de produit
PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate
MKSP-S630T high-precision lamination press plate utilizes premium domestic SUS630T stainless steel materials, delivering stable and reliable lamination performance with superior cost competitiveness. This specialized lamination steel plate for PCB and CCL production features exceptional thermal performance, high hardness, and outstanding corrosion resistance.
Product Advantages
SUS630T High-Hardness Lamination Press Plate | High Precision, High Temperature Resistance, Energy-Saving & Cost-Effective Solution for PCB & CCL Lamination
| Feature | Specification & Benefits |
|---|---|
| Raw Material | High-quality domestic SUS630T stainless steel with mature, stable material formula |
| Cost Performance | Reliable industrial-grade lamination quality with highly competitive pricing |
| Thermal Performance | Excellent thermal conductivity and stable thermal expansion coefficient for significant energy and cost savings |
| Material Performance | High hardness up to 50HRC±2, excellent corrosion resistance and mechanical stability |
| Equipment Compatibility | Universally compatible with all types of industrial lamination steel plate washing machines |
| Application Scenarios | Professional high-precision press plate for PCB printed circuit board and CCL copper clad laminate lamination processes |
Standard Sizes
PCB Lamination Press Plate (L × W, mm):
1500×1295, 1300×800, 1295×787, 1295×1613, 1295×1143, 1295×787, 1285×750, 1280×1120, 1280×1070, 1280×970, 1270×1118, 1270×1070, 1143×660, 673×571, 660×508, 24"×28"
1500×1295, 1300×800, 1295×787, 1295×1613, 1295×1143, 1295×787, 1285×750, 1280×1120, 1280×1070, 1280×970, 1270×1118, 1270×1070, 1143×660, 673×571, 660×508, 24"×28"
CCL Lamination Press Plate (L × W, mm):
1910×1270, 2210×1270, 2220×1270
1910×1270, 2210×1270, 2220×1270
Detailed Performance Parameters
| Performance Parameter | Mass-Lam Plate (SUS630T) | Pin-Lam Plate (SUS630T) |
|---|---|---|
| Thickness | 1.0-2.0mm | 1.0-2.0mm |
| Max Width | ≤1300mm | ≤1300mm |
| Max Length | ≤2410mm | ≤2410mm |
| Thickness Tolerance | ±0.10mm | ±0.10mm |
| Surface Roughness | Ra≤0.15μm, Rz≤1.5μm | Ra≤0.15μm, Rz≤1.5μm |
| Positioning Hole Tolerance | -- | ±0.10mm |
| Standard Bushing Slot Tolerance | -- | 0 ~ +0.10mm |
| Warpage Degree | ≤3mm/M | ≤3mm/M |
| Length & Width Tolerance | ±1mm | ±1mm |
| Yield Strength | ≥1175 N/mm² | ≥1175 N/mm² |
| Tensile Strength | ≥1400 N/mm² | ≥1400 N/mm² |
| Extensibility | ≥5% | ≥5% |
| Hardness | 50HRC±2 | 50HRC±2 |
| Max Working Temperature | ≤400℃ | ≤400℃ |
| Parallelism | ≤0.03mm | ≤0.03mm |
| Diagonal Deviation | 1-2mm | 1-2mm |
| Thermal Conductivity (@300℃) | ≥18W/MK | ≥18W/MK |
| Average Thermal Expansion Coefficient | 10~12 (10⁻⁶/℃) | 10~12 (10⁻⁶/℃) |
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